This is to help the device be soldered on the PCB, and the size of the Paste mask is the same as the size of the pads. (1)This layer is used to make the stencil with punching holes, and the holes in the stencil correspond to the solder joints of the SMD devices on the printed circuit board. PCB Paste Mask Layers (also known as solder resist) in Altium Designer Understanding how the solder mask layer is designed is a critical step prior to PCB fabrication and assembly. In fact, this solder mask uses a negative output, so after the shape of the solder mask is mapped to the PCB, it is not the green solder resist, but the copper PAD is exposed. (2)In the Altium Designer software, the solder mask PAD refers to the part of the PCB that needs to be painted with green (or other colors) solder resist. By using solder resist, this problem can be prevented. And modern printed circuit boards have very thin and fine pitch tracks and component pins that can cause short circuits after the soldering process. A solder mask acts as a PCB insulation, preventing corrosion, oxidation, or damage from chemical exposure. The solder mask layer covers exposed copper traces on the surface of the printed circuit board. (1)It is an epoxy or photoimaging polymer layer used to protect copper on the PCB surface to prevent welding. PCB Solder Mask Layers (also known as solder resist) in Altium Designer Let’s learn together how to distinguish it follow the below content. What is the difference between them? These two layers are the most difficult to understand in Altium Designer. When using Altium Designer to draw a PCB, you will find that there are solder mask layers and solder paste layers.
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